Screw securing, high firmness Content: 1 pen/ 10 ml Colour: Blue Screw securing, medium curing High firmness New developed Pen-System which enables pen positioning Easy application, clean processing and improved dosing Comparable with Loctite 243
Screw securing, low firmness Contents: 10 ml Screw securing material, fast curing Low firmness
Loctite 460 contents: 20 g Transparent fast curing glue. Also suitable for polycarbonate and Trivex lenses.
Solder yellow, universal, Pallarium Metal contents: 33% Ag For soldering of: Silver, Nickel, Chrome, Stainless Steel, Gold, Brass Melting point: 580°C Diameter: 1mm 12 rods at 150 mm each Packing unit: 12 pcs For solderring of all kinds of metals use in p
Solder wire, gold 8ct Metal contents: 333 o/oo Au Field of application: Jewellery and metal frames of gold alloy Melting point: 590 °C Recommended Flux: No. 310100 Weight: 1 g
Length: approx. 155 mm Weight: 14 g Tweezers titanium for soldering Solder rejecting, low heat conduction, highly acid resistant, 100% anti-magnetic, with centering pin, extremely light
Solder white, universal, Pallarium Metal contents: 45% Ag For soldering of: Silver, Nickel, Chrome, stainless steel, gold, brass Melting point: 580°C Diameter: 1mm Packing unit: 12 pcs For solderring of all kinds of metals use in practise.
Solder silver Degussa Metal contents: 60 % Ag without Cd Field of application: Jewellery Melting point: 680 °c Recommended Flux: No. 3112 00 Weight: 2 g
Solder silver Degussa Metal contents: 60% Ag, 23% Cu, 14.5% Zn, 2.5% Sn Field of application: Jewellery Melting point: 680 °C Recommended Flux: No. 3112 00 Weight: 5 g
Solder phantom Metal contents: 55% Ag, Sn Field of application: For practice and nickel-free material Melting point: 660 °C Recommended Flux: No. 3112 00 Weight: 3 g
Solder wire, white Metal contents: 675/1,000 Ag Field of application: silver alloy Melting point: 710 °C Recommended Flux: No. 3112 00 Packing unit: 1 ring/ 5 g
